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LSR Overmolding on Polycarbonate (PC) Substrates: Key Considerations

By Dyanne April 21st, 2026 2 views

LSR overmolding on Polycarbonate (PC) substrates presents unique challenges and opportunities in creating multi-material components. PC offers excellent impact resistance and optical clarity, making it ideal for housings or lenses. Combining it with LSR adds tactile grip, sealing functions, or ergonomic enhancements. However, successful adhesion between these dissimilar materials requires careful consideration of surface preparation, mold design, and process parameters. Without proper bonding, delamination can occur under stress or environmental exposure, leading to product failure.

Surface treatment of the PC substrate is often necessary to promote adhesion with LSR. Techniques such as plasma treatment, corona discharge, or flame treatment modify the PC surface energy, increasing its receptivity to LSR bonding. Chemical primers can also act as intermediaries, forming molecular bridges between the two materials. The choice of treatment depends on the specific PC grade, LSR formulation, and end-use requirements. It's crucial to validate adhesion strength through standardized peel or cross-hatch tests before committing to full production runs.

Mold design for LSR overmolding on PC must address thermal compatibility. PC has a lower heat deflection temperature compared to many engineering plastics. Excessive mold temperatures required for rapid LSR curing can warp or damage the PC insert. Therefore, precise control over mold zone temperatures is essential. Insulating the PC cavity from direct heater contact or using stepped temperature profiles can protect the substrate while ensuring adequate LSR cure. Proper venting is also critical to evacuate air trapped between the layers, preventing voids or weak spots in the bond line.

Process optimization ensures consistent overmolding quality on PC substrates. Injection speed and pressure must be tuned to encapsulate the PC without causing displacement or flashing. Holding pressure compensates for LSR shrinkage without overstressing the interface. Cycle time must balance LSR cure completion with minimizing thermal exposure to the PC. Material compatibility regarding outgassing or chemical interaction is verified through testing. Addressing these factors systematically leads to robust, high-performance composite parts combining the best attributes of both materials.

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