The silicone SIM card slot tray holder is designed for precision consumer electronics applications requiring waterproof sealing, shock resistance, and long-term durability. Manufactured through advanced liquid silicone rubber (LSR) injection overmolding technology, the product combines the flexibility of silicone with the structural stability of plastic or metal substrates.
The overmolding process allows the liquid silicone to bond precisely with the insert structure, creating a compact and highly reliable integrated component. Compared with traditional assembly methods, LSR overmolding improves waterproof capability, assembly consistency, and product lifespan while reducing secondary assembly operations.
Mold Information
| Mold Core Material | S136H |
| Mold Base Material | P20 |
| Number of Cavities | 2 |
| Runner Type | Cold Runner |
| Product Name | Sim Card Tray Holder Slot |
The mold adopts advanced liquid silicone overmolding technology to accurately combine LSR with plastic or metal inserts, ensuring strong adhesion, excellent sealing performance, and stable product quality.
A precision cold runner system keeps the liquid silicone material at controlled temperatures before entering the cavity, reducing material waste and improving molding consistency during high-volume production.
The mold is engineered with precise insert locating structures to ensure accurate positioning of SIM tray substrates during injection molding. This guarantees tight dimensional tolerances and stable assembly performance.
Optimized cavity design and precision machining technology help achieve flash-free molding for small electronic sealing components, reducing secondary trimming processes and improving production efficiency.
Special sealing geometry and silicone compression structures are integrated into the mold design to help achieve reliable waterproof and dustproof performance required for IP67/IP68 electronic products.
The mold can be integrated with robotic arms and automatic demolding systems, supporting fully automated production lines for consumer electronic silicone components. Automated insert loading and part removal improve productivity and reduce labor costs.
Manufactured with premium mold steel and optimized thermal control channels, the mold provides stable long-term production performance and extended service life under continuous mass production conditions.
A: The insert can be made from plastic, stainless steel, aluminum alloy, or other engineering materials depending on the product application and sealing requirements.
A: LSR overmolding provides excellent waterproof sealing, shock absorption, flexibility, dimensional accuracy, and long-term durability for electronic components.
A: Yes. The mold can be designed with precision sealing structures suitable for manufacturing waterproof SIM tray components for IP67/IP68 electronic devices.
A: Yes. The mold is compatible with fully automatic vertical LSR injection molding machines, robotic arms, and automated demolding systems for efficient mass production.
A: LSR overmolding is widely used in consumer electronics, automotive connectors, medical devices, wearable products, and industrial sealing applications.
A: Yes. Customized cavity layouts, product dimensions, runner systems, and automation solutions can be developed according to customer requirements and production capacity needs.
